Product range

Six grades, one spectrum.

Every FCP grade sits at a defined position on the particle-size spectrum below — from ultrafine sintering powder to broad press-and-sinter granulate. Several grades' cuts overlap, so each gets its own row. Select a grade to jump to its datasheet.

µm — particle size (log scale)
Click a grade for its full datasheet

Need a cut outside these six? We also classify to custom particle-size fractions on request.

FCP-20

Ultrafine powder for sinter-active electronics.

FCP-20 is classified below 20 µm for maximum specific surface area, giving it high sinter activity in conductive pastes, contacts and fine sintered structures.

Applications: Electronics, sintered contacts, conductive pastes

Micrograph of FCP-20 particles
Particle size<20 µm
Sphericity>0.9
Specific surfaceHigh (BET)
Tap density~3.8 g/cm³
Copper content>99.9%
Feedstock100% recycled

FCP-BJ

Fine spherical powder for binder jetting.

Classified for consistent recoating and high green density in binder-jet printing, FCP-BJ supports fine feature resolution ahead of the sintering step to full density.

Applications: Binder jetting, complex geometries, batch AM production

Micrograph of FCP-BJ particles
Particle size20–45 µm
Sphericity>0.9
Flowability (Hall)~16 s/50 g
Apparent density~4.5 g/cm³
Copper content>99.9%
Feedstock100% recycled

FCP-AM

Spherical powder built for laser processing.

Spheroidal and free-flowing, FCP-AM is tailored to laser powder bed fusion and directed energy deposition. Its rough surface absorbs about twice as much 1070 nm laser light as gas-atomised powder, which widens the process window on standard infrared machines.

Applications: LPBF of pure-copper parts, DED, high-conductivity components

Micrograph of FCP-AM particles
Particle size20–63 µm
Sphericity>0.9
Apparent density~4.0 g/cm³
Tap density~4.8 g/cm³
Flowability (Hall)~14 s/50 g
Copper content>99.9%
Oxygen content≤400 ppm
Laser absorption (1070 nm)~2× gas-atomised
Feedstock100% recycled

FCP-EBM

Coarser spherical powder suited to electron-beam processing.

Tailored to the larger beam spot and vacuum environment of electron beam melting, FCP-EBM balances flowability with reduced fines for stable powder-bed spreading.

Applications: EBM of copper components, high-conductivity parts

Micrograph of FCP-EBM particles
Particle size63–100 µm
Sphericity>0.9
Apparent density~5.1 g/cm³
Copper content>99.9%
Feedstock100% recycled

FCP-Si

Engineered for spark plasma and pressureless sintering.

FCP-Si is tailored to direct consolidation via spark plasma sintering (SPS) or pressureless sintering routes, reaching high density without a separate pressing step.

Applications: SPS-consolidated parts, pressureless-sintered components, functional structures

Micrograph of FCP-Si particles
Particle size45–150 µm
Sphericity>0.9
Consolidation routeSPS / pressureless sintering
Apparent density~4.0 g/cm³
Green strength90 % of water-atomised powder
Flowability (Hall)High
Copper content>99.9%
Feedstock100% recycled

FCP-PM

Rough surface, built for green strength.

FCP-PM's rough particle surfaces interlock under pressure, giving strong green compacts for classic press-and-sinter routes — 90 % of the green strength of water-atomised powder in first trials. The broadest of the six grades, for general powder-metallurgy use where a tight process-specific cut isn't required.

Applications: Press & sinter components, bearings, structural parts

Micrograph of FCP-PM particles
Particle size20–150 µm
Sphericity>0.9
MorphologyRough, spheroidal
Apparent density~2.6 g/cm³
Green strength90 % of water-atomised powder
Copper content>99.9%
Feedstock100% recycled

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